In a bid to offer users promising devices, the American tech giant Apple has revealed today that it’s upcoming Apple M2 Pro will be the first chip to adopt TSMC’s 3nm. It is expected to arrive in the year’s second half, 2022.
Industry sources foretell that by the end of 2022, Apple will be the first client to adopt 3nm chips, that Intel will increase its usage of 3nm for tile processor manufacture in the second half of 2023, and that Qualcomm, MediaTek, Broadcom, and other companies will follow by 2023. In 2024, the business is rumored to have finished developing a new 3nm semiconductor.
According to equipment officials and Apple’s production chain executives, the company will use TSMC’s 3nm wafers for the first time in the second half of 2022. Apple is TSMC’s favorite customer for its cutting-edge technologies.
Given the development, the M2 Pro processor will be the first product. In 2023, TSMC’s 3nm wafers are anticipated to be used in the M2 and M3 series processors and the new application processor A17 for the iPhone.
Meanwhile, it won’t be the first time Apple was first in line for TSMC’s most cutting-edge node if this disclosure proves to be true. If you recall, it first announced the 5nm M1 chip in 2020. TSMC’s 5nm is just now being used by AMD and Nvidia for their next-generation GPUs, despite almost two years have passed. For its future Zen 4 CPUs, AMD is also utilizing this node. Similar to AMD, Intel is presently utilizing its third-generation Intel 7 10nm technology for Alder Lake.
The 3nm node from TSMC is the company’s last stop on the FinFET express. After that, a gate-all-around architecture for 2nm purportedly utilizing nanosheet transistors will be used. It is anticipated to produce moderate gains over its 5nm technology, as shown in the chart above. According to sources, the company is already completely booked, so selling its new chips won’t be a problem. Additionally, TSMC previously stated that it anticipates continuing to create 3nm products for at least the ensuing three years.
