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Hot Chips 34: Intel Sets New Era of Chipmaking to Meet World Compute Demands

Yusuf Balogun
Yusuf Balogun
Yusuf is a law graduate and freelance journalist with a keen interest in tech reporting.

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As the world continues to witness another largest tech conference, Hot Chips 34, the American tech giant Intel has highlighted how it plans to achieve a new era of chipmaking to meet the world’s demand for computing. This was disclosed by the company’s CEO, Pat Gelsinger, at the ongoing online conference.

Gelsinger pointed out that the latest architectural and packaging innovations enabling the 2.5D and 3D tile-based chip designs will bring about a new era in chipmaking and propel Moore’s Law forward for years to come.

According to him, the firm is committed to a path for continuing its relentless pursuit of more powerful computing, providing details from across the company’s upcoming portfolio, including Meteor Lake, Ponte Vecchio GPU, Intel® Xeon® D-2700 and 1700, and FPGAs, and outlining its new systems foundry model. With the company’s four upcoming portfolios, a new era of chipmaking will be achieved.

Intel’s Upcoming Portfolio Revealed in Hot Chips 34

  • 1. Meteor Lake:

Personal computers will be transformed by the tile-based chip architectures in the Meteor Lake, Arrow Lake, and Lunar Lake CPUs, increasing manufacturing, power, and performance efficiency. This is accomplished using Intel’s Foveros interconnect technology with discrete CPU, GPU, SoC, and I/O tiles layered in 3D topologies.

2. Ponte Vecchio GPU:

Intel Data Center GPU, code-named Ponte Vecchio, was developed to address the computational density across high-performance computing (HPC) and AI supercomputing workloads. Additionally, it makes the most of Intel’s open software paradigm by utilizing OneAPI to make cross-architecture programming and API abstractions simpler.

3. Intel® Xeon® D-2700 and 1700:

The Xeon D-2700 and 1700 series are made with a focus on the power and space limitations typical in many real-world implementations. They are intended to meet edge use cases for 5G, IoT, corporate, and cloud applications. In addition to having cutting-edge compute cores, 100G Ethernet with flexible packet processors, inline crypto acceleration, time coordinated computing (TCC), time-sensitive networking (TSN), and built-in AI process optimization; these chips are also good examples of tile-based design.

4. FPGAs:

FPGA technology has great potential for radio frequency (RF) applications as a powerful and adaptable tool for hardware acceleration. By cutting development time and maximizing developer freedom, Intel has discovered new efficiencies by merging digital and analog chiplets and chipsets from several process nodes and foundries. The outcomes of Intel’s chipset-based strategy will be released soon.

Intel’s CEO Remarks

However, Pat Gelsinger mentioned at the Intel Hot Chips 34 conference that the industry is entering a new golden age of semiconductors – an era in chipmaking that requires a shift from the traditional foundry model mindset to a systems foundry. 

“Combined with other advances like RibbonFET, PowerVia, High NA lithography, and developments with 2.5D and 3D packaging, we have an aspiration to move from 100 billion transistors on a package today to 1 trillion by 2030. There has never been a better – or more important time – to be a technologist. We must all be ambassadors for the crucial role semiconductors play in life today.”


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