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Big Tech Giants Lining Up for Mass Production of TSMC’s 3nm Process Capacity

Yusuf Balogun
Yusuf Balogun
Yusuf is a law graduate and freelance journalist with a keen interest in tech reporting.

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Last week is another milestone in the technology industry as the world witnessed the Taiwan Semiconductor Manufacturing, TSMC 2022 Technology Symposium, where the company shares its process technology roadmaps as well as its future expansion plans.

During the tech symposium, the Taiwan semiconductor announced its leading-edge nodes that belong to its N3 and N2 families that will be used to make advanced CPUs, GPUs, and SoCs in the coming years. With this announcement, big tech giants and TSMC’s main customers are excited and waiting in line for the production capacity of the 3nm process.

Besides, the company disclosed at the event that the trial production of TSMC’s 3nm process is going well, and the monthly production capacity in the initial stage of mass production is likely to exceed 25,000 wafers.

As per reports, the monthly production capacity of the 3nm process in the Hsinchu Science Park is expected to reach 10,000-20,000 wafers at the initial stage of mass production, and 15,000 wafers in the Tainan Science Park.

Back in the second half of last year, TSMC had begun risk trial production of the 3nm process technology and will mass-produce wafers for its main customers such as Apple in the second half of this year.

Apple, AMD, Nvidia, Broadcom, Qualcomm, MediaTek, as well as Intel are among the big tech giants lining up for 3nm process capacity from TSMC. This is in line with the fab tool manufacturers and reports from the English-foreign media.

Umpiring from reports, TSMC has prepared four waves of 3nm production capacity in the 3nm risk trial production. The majority of the first wave of production capacity will be held for Apple, their long-term customer, while the last three waves of production capacity will be used by Qualcomm, Intel, Nvidia, AMD, and other manufacturers.

Recall that at the end of last year, Pat Kissinger made his first trip to Asia as Intel CEO to pay a visit to TSMC and conducted a closed-door discussion with TSMC executives to discuss work concerns. Thus, Intel is also a major player looking for the production capability of TSMC’s 3nm process. Stay connected with TechGenyz for more tech news.


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