The second generation of Qualcomm’s modem chips to connect phones to 5G has been launched this week. This chip, known as the Xiaolong X55 baseband chip, is an all-rounder upgrade from Qualcomm’s previous X50 with respect to the process, RF components, and network speed.
The size of the Qualcomm Xiaolong X55 seems to be quite small, which could fit into both computers as well as wearable devices.
The Xiaolong X55 uses a 7nm process as compared to the 28nm process on the X50. It is supposed to be more technologically superior to the process used on the X50, more so because the 7nm process on the X55 would help reduce heat and power consumption, thereby improving the overall 5G mobile experience.
Moreover, the X55 is compatible with all networks from 2G to 5G and would help increase the download speed, making it capable of reaching the levels of even 7Gbps (875MB/s) in the 5G mode, where the peak upload speed claims to be around 3Gbps. It’s debatable whether the chip can really assist in reaching these peak levels of speed, but it definitely brings with it a hugely improved network speed.
With this launch, Qualcomm has contributed much to the advocacy of 5G in this race to develop faster wireless data connections and aims at mass production of the X55 so as to facilitate the spread of 5G phones.
Huawei announced in January that its new 5G chip would be used in Huawei phones. Samsung, too, has the Exynos 5100- a 5G modem. Taiwan-based MediaTek, too, has its 5G chip, while IntelCorp is likely to release its own in the second half of 2019.
Qualcomm has launched the QTM525, a second-generation new millimeter-wave antenna module with the Opteron X55. The QTM525 provides support for the 26GHz HF band and helps achieve full compatibility with global 5G networks. Qualcomm aims to develop several chips related to the 5G modems and sell these technologies to phone makers and thereby speed up the adoption of 5G.
