Back in May this year, Samsung announced the mass production of its newest DRAM-optimized next-generation computing device, the 16GB DDR5 DRAM. The DRAM includes artificial intelligence applications, for greater power efficiency and productivity.
Following this achievement, the world’s leader in advanced memory technology has today unveiled a new Samsung 32Gb DDR5 DRAM using 12-nanometer class process technology. The latest DRAM was developed for the ideal AI era and is the industry’s first with the highest capacity.
Samsung 32GB DDR5 DRAM Developed for the Ideal AI Era
Commenting on the new Samsung 32GB DDR5 DRAM, SangJoon Hwang, Samsung’s Executive Vice President of DRAM Product and Technology, said its latest memory technology was developed for the Ideal AI Era.
“With our 12nm-class 32Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1 terabyte (TB), allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data,” said SangJoon Hwang. “We will continue to develop DRAM solutions through differentiated process and design technologies to break the boundaries of memory technology.”
Using 12 nm class to Enhance Efficiency
When employing 16 GB of DRAM, DDR5 128GB DRAM modules had to be produced using the Through Silicon Via (TSV) method. The 128GB module may now be produced without the TSV process and with a 10% reduction in power consumption compared to 128GB modules with 16 GB DRAM by using Samsung’s 32 GB DRAM. Because of this technological advancement, the product is the best choice for businesses like data centers that place a high priority on power efficiency.
The newest memory product from Samsung boasts the largest capacity for a single DRAM chip in the industry and provides double the capacity of 16 GB of DDR5 DRAM in the same package size. It was developed utilizing cutting-edge methods and technologies to boost integration density and design optimization.
Samsung intends to keep growing its array of high-capacity DRAM to satisfy the present and future demands of the computing and IT sectors using its 12nm-class Samsung 32GB DDR5 DRAM as a foundation.
By providing the 12-nm class 32GB DRAM to data centers and clients who require applications like artificial intelligence and next-generation computing, Samsung claimed it will reinforce its dominance in the next-generation DRAM industry. The item will be crucial to Samsung’s ongoing partnerships with other significant business players.
According to the world’s memory technology leader, mass production of the new 12nm-class Samsung 32GB DDR5 DRAM is scheduled to begin by the end of this year.
