Today, on August 12, Honor launched its Magic 3 series in the global market. The launch had more than one model feature at the online event. Fang Fei, Honor’s President of Product Line, stated that the new devices would be powered by Qualcomm’s top Snapdragon 888+ chipset.
The Honor Magic3 Series 5G will be announced during the worldwide event on August 12, according to a post from the Honor Global Twitter account. Because the word “series” was used, we can expect more than one model to be revealed at the online event.
According to previous rumors, there will be more than one Magic phone this year, including a foldable. The Magic3 series has three models, according to a number of Chinese tipsters.
In a tweet earlier this week, the reliable leaker @RODENT950 revealed that the Magic3 series has three models with model numbers ELZ-AN00, ELZ-AN10, and ELZ-AN20, implying that there would be a base version as well as pro and pro+ variations. The foldable Honor Magic, we believe, isn’t one of the aforementioned gadgets.
Honor’s President of Product Line Fang Fei has stated that the new smartphones would be powered by the top Snapdragon 888+ chipset, confirming a previous claim. When the Snapdragon 888+ was first announced, Fei stated that Honor will use it to produce “a mobile experience that will satisfy the expectations of even the most demanding users.”
According to rumors, the Honor Magic 3 series would have three smartphones with model numbers ELZ-AN00, ELZ-AN10, and ELZ-AN20. As a result, we should expect a normal Honor Magic 3, Honor Magic 3 Pro, and a high-end model called the Magic 3 Pro+, similar to the predecessors.
The main camera of the Honor Magic 3 models is shown in the teaser image given by the firm. Because it’s such a close-up shot, any predictions aren’t worth much. Looking at it, we may deduce that the smartphone’s main camera will have a big sensor, which may be excellent news for users. Stay tuned for more information on forthcoming cellphones and other tech-related items.
