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MediaTek Unveils Dimensity 6100+ Chip to Enhance Next Generation of 5G Devices

Yusuf Balogun
Yusuf Balogun
Yusuf is a law graduate and freelance journalist with a keen interest in tech reporting.

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In a bid to enhance the next generation of mainstream 5G devices, the global fabless semiconductor MediaTek has unveiled a new chipset – the Dimensity 6100+ SoC. The new chipset offers premium features like outstanding power efficiency, vivid displays, fast frame rates, AI-powered camera technologies, industry-leading low power consumption, and dependable Sub-6 5G connectivity.

Aside from the fascinating premium features, the Dimensity 6100+ SoC chipset also comes with an affordable price. According to the American semiconductor maker, the first smartphones featuring the new +- will be available in the third quarter of 2023.

CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, said the new Dimensity 6000 series offers outstanding advancements that improve performance, increase power efficiency, and enable device manufacturers to stay ahead of the curve.

“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity, said CH Chen. The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”

Enhancing the Next Generation of 5G Devices with Dimensity 6100+ SoC

Using MediaTek UltraSave 3.0+ technology, the Dimensity 6100+ includes an improved 5G modem that supports the 3GPP Release 16 standard and up to 140MHz 2CC 5G Carrier Aggregation while also dramatically decreasing power consumption. This processor offers considerable improvements, including support for AI-powered cameras, 10-bit displays, great UX and GPU performance, and a wealth of peripheral functions. It has two Arm Cortex-A76 large cores and six Arm Cortex-A55 efficiency cores.

For decades, MediaTek has been known for its broad 5G portfolio that expands across different price tiers to make great mobile experiences more accessible. For instance, its Dimensity 8000 family is aimed towards high-end mobile devices, while the Dimensity 7000 lineup broadens the company’s selection of high-tech devices, and the Dimensity 9000 series is created for flagship smartphones and tablets.

But, the new Dimensity 6000 series is aimed at providing affordable and enhancing the next generation of mainstream 5G devices with its premium features like exceptional power efficiency, AI-powered camera technologies, and reliable Sub-6 5G connectivity. Other key features of the new Dimensity 6100+ chipset include:

  • Up to 108MP Non-ZSL camera support.
  • Up to 2K 30fps video capture.
  • UltraSave 3.0+ technology offers 20% reduced 5G power consumption compared to competitive solutions.
  • Powerful camera features, including AI-bokeh for stunning portraits and selfies; working with Arcsoft, MediaTek is also bringing AI-color technology to mainstream devices so users can showcase their creativity.
  • Premium 10-bit display support: Reproduces more than one billion colors for vibrant images and videos, along with support for 90 Hz to 120Hz frame rates for a smooth user experience.


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