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Samsung Is Cooking Up a “Glass Substrate” Packaging Solution and Aims to Have It on the Market by as Soon as 2026

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The Korean tech giant Samsung has been meticulously working on the down low on a project that hasn’t yet surfaced in the world of humanity. However, the company is plunging into the advancement of “Glass Substrate” technology, according to Korean media outlet Sedaily. What’s their goal? To step up high-output manufacturing by the end of 2026.

Although this isn’t Samsung’s first encounter with “Glass Substrate,” they’ve been assessing the concept and scrutinizing it for a while. Intel has already waded into it a few years back, but it didn’t yield the outcomes it had hoped for. Currently, the pioneer of Flip and Foldable phones has passed the baton to their subsidiary, Samsung Electro-Mechanics, to act as a frontier on the research and development of “Glass Substrate.”

Let’s discuss “Glass Substrate.” It’s dubbed as a game-changer in computer chip packaging, dismissing all the shortcomings of traditional methods like organic packaging. But it’s not going to be all smooth sailing. There are still a plethora of hurdles to jump over in the commercialization process.

Here’s the lowdown: “Glass Substrate” packs all the big guns with higher packaging strength compared to its organic counterparts. Interpretation? It’s hard-wearing and reliable for the long haul. Plus, thanks to glass being thinner than organic materials, you get your money’s worth with higher interconnection density. In a plain statement, you can cram more transistors into a single package.

Samsung seems to have smelled the roses, and they love the scent of glass substrates. That’s why they’re pooling the talent from their major subsidiaries to make this dream a reality. They’re not blindfolded and trussed up to the challenges ahead, but they’re rolling up their sleeves and diving in headfirst. Watch out, world—Samsung’s on a mission, and they’re not taking no for an answer.


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